Bridgelux Announces U.S. Patent Award for Surface Mountable LED Chip

SUNNYVALE, CA, January 15. Bridgelux, a supplier of energy-saving, light-emitting diode (LED) technology for high-volume, solid-state lighting markets, has announced the award of a U.S. patent for its surface mountable chip (SMC) LED design. According to Bridgelux, this SMC architecture changes how LEDs will be deployed by eliminating the need for traditional LED packaging. The innovative chip design offers a high-flux density LED with an ultra small footprint and thin profile, with the ability to closely pack multiple chips together for increased performance in space-limited applications such as camera flash, LCD display backlighting, and general or specialty lighting applications. The design of this chip also delivers a surface mountable "thin-film" architecture, providing a flat surface for direct deposition of a phosphor layer on the LED die.

The Bridgelux SMC LED design enables manufacturers to bond the chip directly onto the printed circuit board (PCB), eliminating the need for an additional substrate or traditional LED package. This is the first discrete, thin-film device with two bottom contacts and a flat surface on which a phosphor can be applied. Bridgelux claims that direct deposition of phosphor film at either the wafer or package level can achieve a quality of white color consistency that no other commercially available LED die platform can currently offer.